Issue of Debt

Subject: The Company's Board of Directors approved the issuance of unsecured corporate bond

Date of events:2013/05/14

Contents:

1.Date of the board of directors resolution：2013/05/14

2.Name 【__nth issue of (secured, unsecured) corporate bonds of ___ Co.】:

Hon Hai Precision Industry Co., Ltd. unsecured corporate bond issue

3.Total amount of the issue：Aggregate amount not exceed NTD 12,000,000,000

(can be in installments)

4.Face value：NTD 1,000,000

5.Issue price：At Par

6.Issue period：Depends on market condition

7.Issue coupon/interest rate：Depends on pricing

8.Types, names, monetary amounts of security or collateral and stipulations Thereupon：None

9.Use of the funds raised by the offering and utilization plan：

Repay short-term debt

10.Underwriting method：No public offering

11.Trustees for the bonds：To be decided

12.Underwriter or distributing agent institution：None

13.Guarantor(s) for the issue：None

14.Institution serving as agent for payment of the principal and interest：

To be decided

15.Certifying institution：None

16.Where convertible into shares, the rules for conversion：None

17.Resale conditions：None

18.Repurchase conditions：None

19.The record date for share conversion, if conversion, exchange, or

subscription rights are attached：None

20.Possible dilution of equity, if conversion, exchange, or subscription

rights are attached：None

21.Any other matters that need to be specified：None