Issue of Debt

Subject:

Supplement to The Unsecured Corporate Bond Issuance Authorized by the Board of

Director Resolution Dated May 14th, 2013.

Date of events:2013/12/06

Contents:

1.Name 【__nth issue of (secured, unsecured) corporate bonds of ___ Co.】:

Hon Hai Precision Industry Co., Ltd. 3rd unsecured corporate bond issuance in 2013

2.Total amount of the issue:Aggregate amount NTD 6,000,000,000

3.Face value:NTD 1,000,000

4.Issue price:At Par

5.Issue period:3-year、5-year and 7-year

6.Issue coupon/interest rate:

Fixed rate at 1.35% p.a.(3-year)、1.50% p.a.(5-year) and 1.85% p.a.(7-year)

7.Use of the funds raised by the offering and utilization plan:Repay short-term debt

8.Underwriting method:Non public offering

9.Trustees for the bonds:Bank Sinopac Co., Ltd.

10.Institution serving as agent for payment of the principal and interest:

Bank Sinopac Co., Ltd. ChengChung Branch.