Expands mobile computing collaboration with Intel

Telit Communications PLC

Telit to expand its mobile computing offerings - leveraging collaboration with Intel®

MWC, Barcelona, February, 25, 2013 - Telit Communications PLC, (AIM: TCM, "Telit" or the "Company"), the leading machine-to-machine wireless technology company, today announced the introduction of a family of new data cards in the new M.2, Next Generation Form Factor (NGFF).

The data cards augment the company's mobile computing product line currently comprised of mPCIe modules in HSPA+ and 1xEvDO cellular technologies. The new data cards are to be based on Intel's designs for LTE/DC-HSPA+ and HSPA+. They target not only leading edge adopter applications such as Ultrabook™, laptops, tablets, but also commercial and industrial devices, as the current favored mPCIe form factor gets gradually replaced by M.2.

Oozi Cats, CEO of Telit said:

"Until recently, a large cellular infrastructure equipment vendor held a 50% market share in the data card market used in mobile computing, primarily with the mPCIe format. However, this supplier has exited the market representing a potentially disruptive development in the supply chain.

"Telit is perfectly positioned to step in to fill the gap given the high confidence level we enjoy with our customers, particularly OEMs with respect to long-term, high-volume supply as well as our strong global and local support structure."

Horst Pratsch, head of Product Line Modules & M2M at Intel Corporation said:

"Intel is pleased to be working with Telit to bring to market highly competitive modules offering worldwide coverage, high performance, and an optimized user experience. Telit 3G and 4G M.2 modules take advantage of Intel's experience in ramping cellular technology globally in industry leading smartphone devices, along with integration, validation, and optimization in Intel computing platforms."

Telit's new M.2 lineup will include LN930 and HN930 product families conceived to address both global, regional, and speed requirements from cutting edge LTE/DC-HSPA+ and HSPA+ applications in mobile computing and gadgets. The sub-compact and ultra slim 30x42mm M.2 data cards include global satellite and assisted positioning technology, and certified drivers for Windows™7 & 8.

They also feature the industry's new firmware switching standard, which enables the host operating system and drivers to switch the card's firmware to the latest cellular network version, overcoming a longstanding hurdle in providing cellular connectivity in non-operator branded consumer products. The switching is triggered by inserting the consumer or operator supplied SIM card into the PC.

The M.2 range supports selective suspend (SS) and link power management (LPM) which allows the mobile device driver to put the data card in standby mode when the device goes idle, helping to extend the device's battery life and improving the user experience.

Samples of the new M.2 range will be available in Q2 2013 and are expected to be commercially available in Q3 2013. To accelerate time to market for the PC OEMS, Intel has validated M.2 cards for use with the Intel Tablet and Ultrabook™ reference designs.

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Notes to editors

Telit is a global leader of machine-to-machine (M2M) communications providing wireless module technology via its brand Telit Wireless Solutions, enhanced by managed and value added services, including connectivity via its business unit m2mAIR. Telit has been dedicated to M2M communications for over 12 years and is constantly advancing technological leadership from 6 R&D centers around the globe. Telit offers an extensive portfolio of quality cellular, short-range, and GNSS modules. By supplying business scalable products interchangeable across families, technologies, and generations, Telit is able to keep development costs low and uniquely protect customers' design investments.