13th Nov 2025 21:36
EnSilica PLC - Oxford, England-based computer chip maker - Receives GBP5 million "Contract for Innovation" from the UK government's Department for Science, Innovation & Technology following a competitive process. The commercial-off-the-shelf Capability Hardware Enhanced RISC Instructions compliant secure processor chip developed under the contract will target next-generation of quantum resilient applications. The contract will be phased over two stages. Stage one sees GBP1.5 million specification and prototype development to be completed by March 2026. Stage 2 sees GBP3.5 million verification, silicon implementation and productisation, concluding by March 2028. The contract will cover the direct cost of development from specification to productisation. The contract will be gated against a break clause subject to continuation of funding for stage 2.
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By Jeremy Cutler, Alliance News reporter
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